Chemical Mechanical Polishing Stocks List
Symbol | Grade | Name | % Change | |
---|---|---|---|---|
NVMI | C | Nova Measuring Instruments Ltd. | -1.84 | |
ACMR | C | ACM Research, Inc. | 2.02 | |
ICHR | D | Ichor Holdings | -0.47 |
Related Industries: Semiconductor Equipment & Materials
Related Stock Lists:
Semiconductor
Semiconductor Device Fabrication
Manufacturing Process
Semiconductor Manufacturing
Semiconductor Manufacturing Process
Wafer
Asic
Capital Equipment
Chemical Mechanical Planarization
Chemical Vapor Deposition
Foods
Gas Delivery
Integrated Circuits
Lithography
Manufacturing Industry
Manufacturing Processes
Materials Science
Measuring Instruments
Metrology
Microfabrication
Related ETFs - A few ETFs which own one or more of the above listed Chemical Mechanical Polishing stocks.
Symbol | Grade | Name | Weight | |
---|---|---|---|---|
PSI | B | PowerShares Dynamic Semiconductors | 6.41 | |
MCHS | D | Matthews China Discovery Active ETF | 3.77 | |
TINY | C | ProShares Nanotechnology ETF | 2.48 | |
FDM | B | First Trust DJ Select MicroCap ETF | 2.21 | |
NSCS | A | Nuveen Small Cap Select ETF | 1.57 |
Compare ETFs
Related Industries:
Semiconductor Equipment & Materials
Related Stock Lists:
Semiconductor
Semiconductor Device Fabrication
Manufacturing Process
Semiconductor Manufacturing
Semiconductor Manufacturing Process
Wafer
Asic
Capital Equipment
Chemical Mechanical Planarization
Chemical Vapor Deposition
Foods
Gas Delivery
Integrated Circuits
Lithography
Manufacturing Industry
Manufacturing Processes
Materials Science
Measuring Instruments
Metrology
Microfabrication
- Chemical Mechanical Polishing
Chemical Mechanical Polishing (CMP) is a process used to planarize and smooth surfaces of semiconductor wafers and other substrates. It is a combination of chemical etching and mechanical polishing that uses a slurry containing abrasive particles to remove material from the surface of the substrate. The slurry is applied to the substrate and a polishing pad is used to apply pressure and friction to the surface. The combination of chemical and mechanical action removes material from the surface and creates a smooth, planar surface.
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