Chemical Vapor Deposition Stocks List
Symbol | Grade | Name | % Change |
---|---|---|---|
AEIS | C | Advanced Energy Industries, Inc. | -4.07 |
AMAT | C | Applied Materials, Inc. | 0.07 |
ASYS | C | Amtech Systems, Inc. | 1.81 |
CVV | D | CVD Equipment Corporation | -5.35 |
ENTG | B | Entegris, Inc. | -1.16 |
LRCX | B | Lam Research Corporation | -0.81 |
NVMI | B | Nova Measuring Instruments Ltd. | -0.52 |
VECO | D | Veeco Instruments Inc. | -0.62 |
Related ETFs - A few ETFs which own one or more of the above listed Chemical Vapor Deposition stocks.
Symbol | Grade | Name | Weight |
---|---|---|---|
PSI | B | PowerShares Dynamic Semiconductors | 16.67 |
FTXL | B | First Trust Nasdaq Semiconductor ETF | 13.12 |
SOXX | A | iShares PHLX SOX Semiconductor Sector Index Fund | 10.08 |
SMH | B | Market Vectors Semiconductor ETF | 9.96 |
SOXS | F | Direxion Daily Semiconductor Bear 3x Shares | 9.05 |
View all Chemical Vapor Deposition related ETFs...
Compare ETFs
Date | Stock | Signal | Type |
---|---|---|---|
2021-04-13 | AEIS | Bearish Engulfing | Bearish |
2021-04-13 | AEIS | Stochastic Sell Signal | Bearish |
2021-04-13 | AMAT | Non-ADX 1,2,3,4 Bullish | Bullish Swing Setup |
2021-04-13 | ASYS | 1,2,3 Pullback Bullish | Bullish Swing Setup |
2021-04-13 | ASYS | Non-ADX 1,2,3,4 Bullish | Bullish Swing Setup |
2021-04-13 | CVV | Bollinger Band Squeeze | Range Contraction |
2021-04-13 | ENTG | Non-ADX 1,2,3,4 Bullish | Bullish Swing Setup |
2021-04-13 | LRCX | Non-ADX 1,2,3,4 Bullish | Bullish Swing Setup |
2021-04-13 | NVMI | Hammer Candlestick | Bullish |
2021-04-13 | NVMI | Non-ADX 1,2,3,4 Bullish | Bullish Swing Setup |
2021-04-13 | VECO | 20 DMA Resistance | Bearish |
2021-04-13 | VECO | Hammer Candlestick | Bullish |
2021-04-13 | VECO | Bollinger Band Squeeze | Range Contraction |
2021-04-13 | VECO | MACD Bearish Centerline Cross | Bearish |
Chemical vapor deposition (CVD) is a deposition method used to produce high quality, high-performance, solid materials, typically under vacuum. The process is often used in the semiconductor industry to produce thin films.
In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.
Microfabrication processes widely use CVD to deposit materials in various forms, including: monocrystalline, polycrystalline, amorphous, and epitaxial. These materials include: silicon (dioxide, carbide, nitride, oxynitride), carbon (fiber, nanofibers, nanotubes, diamond and graphene), fluorocarbons, filaments, tungsten, titanium nitride and various high-k dielectrics.
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