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|2020-05-29||BRKS||Doji - Bullish?||Reversal|
|2020-05-29||BRKS||1,2,3 Pullback Bullish||Bullish Swing Setup|
|2020-05-29||BRKS||MACD Bearish Signal Line Cross||Bearish|
|2020-05-29||BRKS||Non-ADX 1,2,3,4 Bullish||Bullish Swing Setup|
|2020-05-29||NPO||Stochastic Sell Signal||Bearish|
|2020-05-29||RELL||Pocket Pivot||Bullish Swing Setup|
|2020-05-29||UCTT||Stochastic Sell Signal||Bearish|
|2020-05-29||UCTT||180 Bullish Setup||Bullish Swing Setup|
Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
The entire manufacturing process, from start to packaged chips ready for shipment, takes six to eight weeks and is performed in highly specialized facilities referred to as foundries or fabs. In more advanced semiconductor devices, such as modern 14/10/7 nm nodes, fabrication can take up to 15 weeks with 11–13 weeks being the industry average.By industry standard, each generation of the semiconductor manufacturing process, also known as "technology node", is designated by the process’s minimum feature size. Technology nodes, also known as "process technologies" or simply "nodes", are typically indicated by the size in nanometers (or historically micrometers) of the process's gate length.As of 2018, 14 nanometer process chips are commonly in mass production, with 10 nanometer class chips about to begin production.