Chemical Mechanical Planarization Stocks List
Symbol | Grade | Name | % Change | |
---|---|---|---|---|
UCTT | D | Ultra Clean Holdings, Inc. | 1.51 | |
ENTG | D | Entegris, Inc. | 2.50 | |
AMAT | D | Applied Materials, Inc. | 2.05 | |
ICHR | F | Ichor Holdings | 0.53 |
Related Industries: Semiconductor Equipment & Materials
Related Stock Lists:
Semiconductor
Semiconductor Device Fabrication
Integrated Circuits
Manufacturing Process
Semiconductor Manufacturing
Semiconductor Manufacturing Process
Capital Equipment
Chemical Vapor Deposition
Flat Panel Display
Gas Delivery
Manufacturing Equipment
Manufacturing Processes
Semiconductor Capital Equipment
Semiconductor Devices
Aerospace Manufacturers
Applied Materials
Chemical Manufacturing
Chemical Mechanical Polishing
Control Solutions
Crystalline Silicon
Related ETFs - A few ETFs which own one or more of the above listed Chemical Mechanical Planarization stocks.
Symbol | Grade | Name | Weight | |
---|---|---|---|---|
PSI | D | PowerShares Dynamic Semiconductors | 13.17 | |
TINY | D | ProShares Nanotechnology ETF | 11.78 | |
FTXL | D | First Trust Nasdaq Semiconductor ETF | 9.67 | |
SOXL | F | Direxion Daily Semiconductor Bull 3x Shares | 6.33 | |
NXTE | D | AXS Green Alpha ETF | 6.09 |
Compare ETFs
Related Industries:
Semiconductor Equipment & Materials
Related Stock Lists:
Semiconductor
Semiconductor Device Fabrication
Integrated Circuits
Manufacturing Process
Semiconductor Manufacturing
Semiconductor Manufacturing Process
Capital Equipment
Chemical Vapor Deposition
Flat Panel Display
Gas Delivery
Manufacturing Equipment
Manufacturing Processes
Semiconductor Capital Equipment
Semiconductor Devices
Aerospace Manufacturers
Applied Materials
Chemical Manufacturing
Chemical Mechanical Polishing
Control Solutions
Crystalline Silicon
- Chemical Mechanical Planarization
Chemical Mechanical Planarization (CMP) is a process used in the semiconductor industry to planarize, or flatten, the surface of a wafer. It is a combination of chemical and mechanical processes that use a slurry of abrasive particles suspended in a liquid to remove material from the wafer surface. The process is used to create a flat, uniform surface on the wafer, which is necessary for the fabrication of integrated circuits.
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