Semiconductor Devices Stocks List


Recent Signals

Date Stock Signal Type
2019-04-22 ASX 180 Bullish Setup Bullish Swing Setup
2019-04-22 CREE New 52 Week High Strength
2019-04-22 CREE New 52 Week Closing High Bullish
2019-04-22 DIOD Fell Below 20 DMA Bearish
2019-04-22 DIOD MACD Bearish Signal Line Cross Bearish
2019-04-22 EMKR Non-ADX 1,2,3,4 Bullish Bullish Swing Setup
2019-04-22 EMKR NR7 Range Contraction
2019-04-22 EMKR Crossed Above 50 DMA Bullish
2019-04-22 ICHR Spinning Top Other
2019-04-22 KLIC Slingshot Bullish Bullish Swing Setup
2019-04-22 LEDS Narrow Range Bar Range Contraction
2019-04-22 LEDS NR7 Range Contraction
2019-04-22 LEDS Boomer Buy Setup Bullish Swing Setup
2019-04-22 LEDS 1,2,3 Pullback Bullish Bullish Swing Setup
2019-04-22 MU Bollinger Band Squeeze Range Contraction
2019-04-22 ON NR7 Range Contraction
2019-04-22 ON NR7-2 Range Contraction
2019-04-22 TAIT 1,2,3 Pullback Bullish Bullish Swing Setup
2019-04-22 TAIT New 52 Week Closing High Bullish
2019-04-22 TAIT 180 Bullish Setup Bullish Swing Setup
2019-04-22 TAIT Non-ADX 1,2,3,4 Bullish Bullish Swing Setup
2019-04-22 TER NR7 Range Contraction
2019-04-22 TER Narrow Range Bar Range Contraction
2019-04-22 TRT Bollinger Band Squeeze Range Contraction
2019-04-22 TRT New Downtrend Bearish
2019-04-22 TRT Reversal New Lows Setup Bearish Swing Setup
2019-04-22 TRT Lower Bollinger Band Walk Weakness
2019-04-22 TRT Wide Range Bar Range Expansion
2019-04-22 TSEM MACD Bearish Signal Line Cross Bearish
2019-04-22 TSEM Non-ADX 1,2,3,4 Bullish Bullish Swing Setup
2019-04-22 TSEM Fell Below 20 DMA Bearish
2019-04-22 TSM Upper Bollinger Band Walk Strength
2019-04-22 TSM Jack-in-the-Box Bullish Bullish Swing Setup
2019-04-22 VSH Expansion Pivot Sell Setup Bearish Swing Setup
2019-04-22 VSH Stochastic Sell Signal Bearish
2019-04-22 VSH 20 DMA Support Bullish

Semiconductor devices are electronic components that exploit the electronic properties of semiconductor material, principally silicon, germanium, and gallium arsenide, as well as organic semiconductors. Semiconductor devices have replaced thermionic devices (vacuum tubes) in most applications. They use electronic conduction in the solid state as opposed to the gaseous state or thermionic emission in a high vacuum.
Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a number ā€“ from a few (as low as two) to billions ā€“ of devices manufactured and interconnected on a single semiconductor substrate, or wafer.
Semiconductor materials are useful because their behavior can be easily manipulated by the addition of impurities, known as doping. Semiconductor conductivity can be controlled by the introduction of an electric or magnetic field, by exposure to light or heat, or by the mechanical deformation of a doped monocrystalline grid; thus, semiconductors can make excellent sensors. Current conduction in a semiconductor occurs via mobile or "free" electrons and holes, collectively known as charge carriers. Doping a semiconductor such as silicon with a small proportion of an atomic impurity, such as phosphorus or boron, greatly increases the number of free electrons or holes within the semiconductor. When a doped semiconductor contains excess holes it is called "p-type", and when it contains excess free electrons it is known as "n-type", where p (positive for holes) or n (negative for electrons) is the sign of the charge of the majority mobile charge carriers. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to control precisely the location and concentration of p- and n-type dopants. The junctions which form where n-type and p-type semiconductors join together are called pā€“n junctions.
Semiconductor devices made per year have been growing by 9.1% on average since 1978, and shipments in 2018 are predicted for the first time to exceed 1 trillion, meaning that well over 7 trillion has been made to date, in just in the decade prior.

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