Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. The company operates in two segments, Packaging and Test. The Packaging segment offers package formats and services using wirebonding and flip chip interconnect technologies, and hybrid technologies that connect the die to the package carrier. Its package carriers include leadframe packages that utilize metal and place the electrical interconnect leads to the system board around the perimeter of the package; substrate packages, which utilize a laminate as the package carrier; and wafer-level packages. This segment's chip scale packages consist of stacked chip scale packages for chipsets and memory applications; package-on-package solutions for the integration of logic and memory in a single footprint; and system-in-package modules that integrate two or more chips and passive device elements into a single package. The Packaging segment also offers ball grid array packages comprising flip chip ball grid array packages that are used with silicon nodes for small devices and other applications; and plastic ball grid array packages, which use wirebond technology. In addition, this segment provides other packaging services, such as wafer bumping services. The Test segment offers semiconductor testing services, including test development services, such as test software, hardware, integration, and product engineering services; wafer test services comprising wafer mapping and inspection activities; various types of final testing, strip testing, and end-of-line test services; and specialized logistical services, including security certification and anti-counterfeit measures. The company primarily serves the communications, consumer, computing, networking, automotive, and industrial markets. Amkor Technology, Inc. was founded in 1968 and is headquartered in Chandler, Arizona.
Semiconductor Device Fabrication
Ball Grid Array
Chip Scale Package
Wafer Level Packaging