Ball Grid Array Stocks List
Symbol | Grade | Name | % Change | |
---|---|---|---|---|
AMKR | C | Amkor Technology, Inc. | 0.77 | |
ASX | D | Advanced Semiconductor Engineering, Inc. | -2.12 |
Related Industries: Semiconductors
Related Stock Lists:
Chip Scale Package
Electronic Engineering
Electronics
Electronics Manufacturing
Flip Chip
Integrated Circuits
Packaging
Semiconductor
Semiconductor Device Fabrication
Automotive Electronics
Computing
Consumer Electronics
Electrical Engineering
Electronics Manufacturing Services
Engineering Services
Logistical Services
Metals
Packaging Services
Semiconductor Devices
Shipment Services
Symbol | Grade | Name | Weight | |
---|---|---|---|---|
FTXL | C | First Trust Nasdaq Semiconductor ETF | 4.1 | |
PSI | C | PowerShares Dynamic Semiconductors | 2.7 | |
AADR | B | WCM BNY Mellon Focused Growth ADR ETF | 2.66 | |
SDVY | B | First Trust SMID Cap Rising Dividend Achievers ETF | 0.98 | |
RNMC | C | First Trust Mid Cap US Equity Select ETF | 0.86 |
Compare ETFs
Related Industries:
Semiconductors
Related Stock Lists:
Chip Scale Package
Electronic Engineering
Electronics
Electronics Manufacturing
Flip Chip
Integrated Circuits
Packaging
Semiconductor
Semiconductor Device Fabrication
Automotive Electronics
Computing
Consumer Electronics
Electrical Engineering
Electronics Manufacturing Services
Engineering Services
Logistical Services
Metals
Packaging Services
Semiconductor Devices
Shipment Services
- Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Soldering of BGA devices requires precise control and is usually done by automated processes.
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