Wafer Level Packaging Stocks List

Wafer Level Packaging

Wafer Level Packaging (WLP) is a type of semiconductor packaging technology that is used to package integrated circuits (ICs) at the wafer level. It involves the direct bonding of the IC to a substrate or carrier, such as a printed circuit board (PCB), without the need for additional packaging components. WLP is a cost-effective and reliable packaging solution that can be used for a variety of applications, including consumer electronics, automotive, and medical devices.

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