Flip Chip Stocks List
Symbol | Grade | Name | % Change |
---|---|---|---|
AMKR | C | Amkor Technology, Inc. | 3.04 |
FORM | D | FormFactor, Inc. | 4.15 |
KLIC | C | Kulicke and Soffa Industries, Inc. | -1.39 |
ASX | C | Advanced Semiconductor Engineering, Inc. | 2.80 |
Symbol | Grade | Name | Weight |
---|---|---|---|
PSI | C | PowerShares Dynamic Semiconductors | 6.05 |
PSCT | C | PowerShares S&P SmallCap Information Technology Portfolio | 4.64 |
JSML | C | Janus Small Cap Growth Alpha ETF | 3.0 |
GBGR | D | Global Beta Momentum-Growth ETF | 2.48 |
GLRY | D | Northern Lights Fund Trust IV Inspire Faithward Mid Cap Momentum ESG ETF | 2.21 |
View all Flip Chip related ETFs...
Compare ETFs
Date | Stock | Signal | Type |
---|---|---|---|
2021-03-05 | AMKR | Non-ADX 1,2,3,4 Bullish | Bullish Swing Setup |
2021-03-05 | AMKR | Hammer Candlestick | Bullish |
2021-03-05 | ASX | Non-ADX 1,2,3,4 Bullish | Bullish Swing Setup |
2021-03-05 | ASX | Crossed Above 50 DMA | Bullish |
2021-03-05 | FORM | Pocket Pivot | Bullish Swing Setup |
2021-03-05 | FORM | Lower Bollinger Band Walk | Weakness |
2021-03-05 | KLIC | Non-ADX 1,2,3,4 Bullish | Bullish Swing Setup |
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Dept., Utica, N.Y. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.
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