Flip Chip Stocks List

Recent Signals

Date Stock Signal Type
2021-03-05 AMKR Non-ADX 1,2,3,4 Bullish Bullish Swing Setup
2021-03-05 AMKR Hammer Candlestick Bullish
2021-03-05 ASX Non-ADX 1,2,3,4 Bullish Bullish Swing Setup
2021-03-05 ASX Crossed Above 50 DMA Bullish
2021-03-05 FORM Pocket Pivot Bullish Swing Setup
2021-03-05 FORM Lower Bollinger Band Walk Weakness
2021-03-05 KLIC Non-ADX 1,2,3,4 Bullish Bullish Swing Setup

Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Dept., Utica, N.Y. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.

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