Flip Chip Stocks List

Flip Chip Stocks Recent News

Date Stock Title
Nov 1 AMKR Bear Of The Day: Amkor Technology (AMKR)
Oct 31 ASX ASE Technology Holding Co., Ltd. 2024 Q3 - Results - Earnings Call Presentation
Oct 31 ASX ASE Technology Holding Co., Ltd. (ASX) Q3 2024 Earnings Call Transcript
Oct 31 ASX ASE Technology Hldg: Q3 Earnings Snapshot
Oct 31 FORM FormFactor Inc (FORM) Q3 2024 Earnings Call Highlights: Record Revenue and Strategic Growth ...
Oct 31 ASX ASE Technology reports Q3 results
Oct 31 ASX ASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the Third Quarter of 2024
Oct 31 FORM FormFactor, Inc. (FORM) Q3 2024 Earnings Call Transcript
Oct 30 FORM FormFactor, Inc. 2024 Q3 - Results - Earnings Call Presentation
Oct 30 FORM FormFactor (FORM) Surpasses Q3 Earnings and Revenue Estimates
Oct 30 FORM FormFactor Non-GAAP EPS of $0.35, revenue of $207.92M
Oct 30 FORM FormFactor: Q3 Earnings Snapshot
Oct 30 FORM FormFactor (NASDAQ:FORM) Q3 Sales Beat Estimates But Quarterly Guidance Underwhelms
Oct 30 FORM FormFactor, Inc. Reports 2024 Third Quarter Results
Oct 30 AMKR Eagles’ Lurie in Talks to Sell Stake in NFL Team to Family Behind Amkor Technology
Oct 30 ASX ASE Technology Q3 2024 Earnings Preview
Oct 30 KLIC Kulicke & Soffa Schedules Fourth Quarter 2024 Conference Call for 8:00 AM EST, November 14th, 2024
Oct 30 AMKR Amkor Technology Third Quarter 2024 Earnings: Revenues Beat Expectations, EPS Lags
Oct 29 FORM FormFactor Q3 2024 Earnings Preview
Oct 29 AMKR Why Amkor (AMKR) Shares Are Trading Lower Today
Flip Chip

Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Dept., Utica, N.Y. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.

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