Flip Chip Stocks List

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Date Stock Signal Type
2020-06-04 AMKR Upper Bollinger Band Walk Strength
2020-06-04 AMKR Pocket Pivot Bullish Swing Setup
2020-06-04 ASX MACD Bullish Centerline Cross Bullish
2020-06-04 KLIC 200 DMA Resistance Bearish
2020-06-04 KLIC Stochastic Reached Overbought Strength
2020-06-04 KLIC Pocket Pivot Bullish Swing Setup

Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Dept., Utica, N.Y. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.

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