Technical Analysis for KLIC - Kulicke and Soffa Industries, Inc.

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and expendable tools to assemble semiconductor devices, including integrated circuits, discrete devices, light-emitting diodes, and power modules. It also services, maintains, repairs, and upgrades its equipment. The company operates in two segments, Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders to connect very fine wires made of gold or copper between the bond pads of the semiconductor devices or dies, and the leads on its package; heavy wire wedge bonders for the power semiconductor and automotive power module markets; wafer level bonders, which mechanically apply bumps to die, while still in the wafer format, for some variants of the flip chip assembly process; and die bonders that are used to attach a die to the substrate or lead frame, which will house the semiconductor device. The Expendable Tools segment provides various expendable tools for a range of semiconductor packaging applications. Its products include capillaries, which are used in ball bonders; bonding wedges for wedge bonders; and saw blades to cut silicon wafers into individual semiconductor die, as well as to cut semiconductor devices that have been molded in a matrix configuration into individual units. The company serves semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. Kulicke and Soffa Industries, Inc. was founded in 1951 and is headquartered in Singapore.