AEHR Stock Discussion

Aehr Test Systems Description

Aehr Test Systems designs, develops, engineers, manufactures, and sells test and burn-in equipment systems that are used in the semiconductor industry worldwide. The company's systems are used to simultaneously perform parallel testing and burn-in of packaged integrated circuits (ICs), singulated bare die, or ICs still in wafer form. Its principal products include the Advanced Burn-in and Test System, a system to test and burn-in high-power logic and low-power ICs; the FOX full wafer contact parallel test and burn-in systems that are designed to make contact with various pads of a wafer simultaneously, which enables full wafer parallel test and burn-in; and the MAX burn-in systems that are designed for monitored burn-in of memory and logic devices. The company also provides WaferPak full wafer contactor, a cartridge system, which includes a full-wafer probe card for use in testing wafers in FOX systems; the DiePak carrier, a reusable, temporary package that enables IC manufacturers to perform final test and burn-in of bare die; and test fixtures that include burn-in board for the ABTS parallel test and burn-in system, and the MAX monitored burn-in system. In addition, it provides customer service and support programs, including system installation, system repair, applications engineering support, spare parts inventories, customer training, and documentation. The company markets its products through a network of distributors and sales representatives to semiconductor manufacturers, semiconductor contract assemblers, electronics manufacturers, and burn-in and test service companies. Aehr Test Systems was founded in 1977 and is headquartered in Fremont, California.

Sector: Technology
Industry: Semiconductor Equipment & Materials
Keywords: Electronics Semiconductor Integrated Circuits Electrical Engineering Electronic Engineering Semiconductor Device Fabrication Wafer Electronics Manufacturers Test Systems Semiconductor Manufacturers Equipment Systems Probe Card Burn In Systems Wafer Level Packaging Wafer Testing