Wafer manufacturing is the process of producing semiconductor wafers, which are thin slices of semiconductor material used in the fabrication of integrated circuits (ICs). The process involves a series of steps including wafer fabrication, wafer testing, wafer dicing, and wafer packaging. Wafer fabrication involves the deposition of various materials onto the wafer surface, such as silicon, metals, and insulators. Wafer testing is used to ensure the quality of the wafer and to detect any defects. Wafer dicing is the process of cutting the wafer into individual chips, and wafer packaging is the process of encapsulating the chips in protective materials.