Acm Research, Inc. is United States-based company. The Company is engaged in providing technology to the semiconductor industry. The Company provides process solutions, for 200 and 300mm wafers, to overcome the limitations of conventional copper electroplating and chemical mechanical polishing techniques. The Company’s Timely Energized Bubble Oscillation (TEBO) technology provides efficient, damage-free cleaning for both conventional 2D and 3D patterned wafers at advanced process nodes. It enables precise, multi-parameter control of bubble cavitation during megasonic cleaning by using a sequence of rapid pressure changes to force bubbles to oscillate in specific sizes and shapes. The Company’s proprietary Space Alternated Phase Shift (SAPS) technology employs alternating Phases of megasonic waves to deliver megasonic energy to flat and patterned wafer surfaces in a highly uniform manner on a microscopic level.